Seongkyun Kim , Taeyeop Kim , Jaehyun Sung , Yongjun Kim , Dongwoo Lee and Seunghyun BaikMaterials Horizons
Thermal rectification is an asymmetric heat transport phenomenon where thermal conductance changes depending on the temperature gradient direction. The experimentally reported efficiency of thermal rectification materials and devices, which are applicable for a wide range of temperatures, is relatively low. Here we report a giant thermal rectification efficiency of 218% by maximizing asymmetry in …
C. MUHAMMED AJMAL, SEOKJAE CHA, WONJOON KIM, K. P. FASEELA, HEEJUN YANG, AND SEUNGHYUN BAIKScience Advances
The dependence of the electrical resistance on materials’ geometry determines the performance of conductive nanocomposites. Here, we report the invariable resistance of a conductive nanocomposite over 30% strain. This is enabled by the in situ–generated hierarchically structured silver nanosatellite particles, realizing a short interparticle distance (4.37 nm) in a stretchable silicone rubber matr…
K. P. Faseela, C. Muhammed Ajmal, Seokjae Cha, Seunghyun BaikAdvanced Functional Materials
Copper (Cu) is an attractive low-cost alternative to silver or gold. However, it is susceptible to oxidation in air. Here, facile in situ regeneration of oxidized Cu flakes (CuFLs) for the synthesis of highly conductive non-oxidized nanocomposites is reported. The oxidized CuFLs are regenerated into non-oxidized CuFLs and Cu nanosatellite (CuNS) particles by formic acid-aided in situ etching and r…
Shabas Ahammed Abdul Jaleel, Taehun Kim, Seunghyun BaikAdvanced Materials
Phase-change materials (PCMs) have received considerable attention to take advantage of both pad-type and grease-type thermal interface materials (TIMs). However, the critical drawbacks of leaking, non-recyclability, and low thermal conductivity (κ) hinder industrial applications of PCM TIMs. Here, leakage-free healable PCM TIMs with extraordinarily high κ and low total thermal resistance (Rt) are…
Significant enhancement of the electrical transport properties of graphene films by controlling the surface roughness of Cu foils before and during chemical vapor deposition
Author
Dongmok Lee, Gi Duk Kwon, Jung Ho Kim, Eric Moyen, Young Hee Lee, Seunghyun Baik and Didier Pribat
We have studied the influence of the surface roughness of copper foils on the sheet resistance of graphene sheets grown by chemical vapor deposition. The surface roughness of the copper foils was reproducibly controlled by electropolishing. We have found that the graphene sheet resistance monotonically decreases as the surface roughness of the copper foils decreases. We show that a pre-annealing treatment combined with an optimized electropolishing process of the Cu foils and a fast CVD growth prevents the evolution of the Cu surface roughness during graphene synthesis. This combination of fabrication conditions produces small grain polycrystalline graphene films with a sheet resistance of 210 Ω □−1 and carrier mobility values as high as 5450 cm2 V−1 s−1 after transfer onto SiO2/Si.
