Seongkyun Kim , Taeyeop Kim , Jaehyun Sung , Yongjun Kim , Dongwoo Lee and Seunghyun BaikMaterials Horizons
Thermal rectification is an asymmetric heat transport phenomenon where thermal conductance changes depending on the temperature gradient direction. The experimentally reported efficiency of thermal rectification materials and devices, which are applicable for a wide range of temperatures, is relatively low. Here we report a giant thermal rectification efficiency of 218% by maximizing asymmetry in …
C. MUHAMMED AJMAL, SEOKJAE CHA, WONJOON KIM, K. P. FASEELA, HEEJUN YANG, AND SEUNGHYUN BAIKScience Advances
The dependence of the electrical resistance on materials’ geometry determines the performance of conductive nanocomposites. Here, we report the invariable resistance of a conductive nanocomposite over 30% strain. This is enabled by the in situ–generated hierarchically structured silver nanosatellite particles, realizing a short interparticle distance (4.37 nm) in a stretchable silicone rubber matr…
K. P. Faseela, C. Muhammed Ajmal, Seokjae Cha, Seunghyun BaikAdvanced Functional Materials
Copper (Cu) is an attractive low-cost alternative to silver or gold. However, it is susceptible to oxidation in air. Here, facile in situ regeneration of oxidized Cu flakes (CuFLs) for the synthesis of highly conductive non-oxidized nanocomposites is reported. The oxidized CuFLs are regenerated into non-oxidized CuFLs and Cu nanosatellite (CuNS) particles by formic acid-aided in situ etching and r…
Shabas Ahammed Abdul Jaleel, Taehun Kim, Seunghyun BaikAdvanced Materials
Phase-change materials (PCMs) have received considerable attention to take advantage of both pad-type and grease-type thermal interface materials (TIMs). However, the critical drawbacks of leaking, non-recyclability, and low thermal conductivity (κ) hinder industrial applications of PCM TIMs. Here, leakage-free healable PCM TIMs with extraordinarily high κ and low total thermal resistance (Rt) are…
Copper (Cu) is an attractive low-cost alternative to silver or gold. However, it is susceptible to oxidation in air. Here, facile in situ regeneration of oxidized Cu flakes (CuFLs) for the synthesis of highly conductive non-oxidized nanocomposites is reported. The oxidized CuFLs are regenerated into non-oxidized CuFLs and Cu nanosatellite (CuNS) particles by formic acid-aided in situ etching and reduction reaction in soft epoxy matrix. The average particle size of CuNS particles is only 3.3 nm with an interparticle distance of 2.7 nm. Furthermore, the negligible potential barrier height between Cu and epoxy dramatically increases the electrical conductivity (66 893 S cm−1) of the nanocomposite (Cu = 46 vol%) by more than three orders of magnitude. The thermal conductivity is also highest (85.1 W m−1 K−1), compared with Cu-based nanocomposites in literature. The conductivities are invariant in air for more than 95 days. The simple scalable in situ regeneration of oxidized CuFLs may find immediate industrial applications.
